Marking

Device Dynamics Asia is committed to providing its customers with the finest marking and demarking services available to the Semiconductor industry. Our guarantee of quality, combined with fast and effective service, has made us the leading subcontractor in this field. Every Device Dynamics Asia production facility worldwide has marking capabilities. Singulated (tubes, trays, bulk) or strip form devices are marked in accordance with stringent customer requirements. Devices can either be marked using laser mark permanency or with ink. Device Dynamics Asia also excels in applications that require “add marking” to designate a device grade. This is done in conjunction with the existing mark. We only use the finest materials in our marking processes. Our inks are selected for adhesion on all plastics, ceramics, metal, and gold-lidded parts. Curing processes are available in UV, oven bake-cure, and air-dry. We have a range of top quality marking machines (ink and laser) on our production floor, which gives us the capability of marking on virtually any semiconductor device, including MLF/QGN, BGA, QFP, TSOP, TSSOP, MSOP, SSOP, SOIC, PLCC, PDIP, just to name a few.

Demark / Erasing

Also known as Microblasting, Device Dynamics Asia has state of the art demark / erasing capabilities in each of its production facilities. Our propriety demark process, in conjunction with our commitment to quality, enables Device Dynamics Asia to offer rapid turn-around times on all devices sent to the company for mark removal with exceptional results. We provide this service for all plastic, ceramic, and even gold-lidded parts. Device markings are removed so that they can be properly remarked without the waste of scrapping the units. This process has been proven effective in nearly all types of devices. Another form of erasing is the use of ink to recoat the unit which is referred to as “black toping.” Devices are held accurately in engineered jigs and masks to cover the unit leads and allow only the top surface to be exposed and coated with ink. Devices are then baked to cure the ink on to the component and meet the test tape adherence specifications for the reliability and quality.